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High Temperature Applications Epoxy Resin
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| Post Date: | Mar 11,2014 |
| Expiry Date: | Mar 11,2015 |
| Detailed Description: |
Cas No. :28768-32-3
Quantity: 1Metric Tons Specs:Epoxy Resin for high temperature applications Price:65 USD Kilograms Payment Method: T/T or L/C Mfg No.: MF-4101 Name: 4, 4'-METHYLENEBIS(N, N-DIGLYCIDYLANILINE) CAS No: 28768-32-3 EC NO: 249-204-3 Molecular Formula: C25H30N2O4 Specification and Application High temperature resistant,apply for 220-270 celcius degree Known Applications 1.Carbon fiber, aramid fiber and glass fiber composite material; 2.Heat-resistant high-performance aerospace structural adhesive; 3.Plastic encapsulation material, electronic encapsulation materials, PCB laminates; 4.Anti-radiation devices. 5. TGDDM epoxy nanocomposites for aerospace and high performance applications Package 5kg/iron drum, 20kg/iron, 200kg/iron drum or per request Productivity 30MT/month Storage Room temperature away from light. Shelf Life 1 year but can be used after retest passes for over one year. |
| CAS Registry Number: | 28768-32-3 |
| Synonyms: | ;Tetraglycidyl-4,4'-methylene dianiline;4,4'-Methylenebis(diglycidyl aniline);2-Oxiranemethanamine, N,N'-(methylenedi-4,1-phenylene)bis(N-(2-oxiranylmethyl)-;4,4'-Methylenebis(N,N-bis(2,3-epoxypropyl)aniline);Oxiranemethanamine, N,N'-(methylenedi-4,1-phenylene)bis(N-(oxiranylmethyl)-;4,4'-methylenebis(N,N-bis(oxiran-2-ylmethyl)aniline);4,4'-methanediylbis[N,N-bis(oxiran-2-ylmethyl)aniline];4,4'-Methylene bis(N,N-diglycidylaniline);4,4-methylenebis(N,N-bis(oxiran-2-ylmethyl)aniline); |
| Molecular Formula: | C25H30N2O4 |
| Molecular Weight: | 422.5167 |
| Molecular Structure: | 
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| Hazard Symbols: |  Xi:Irritant; |
| Risk Codes: | R43:; |
| Safety Description: | S36/37:; |
| Company: | Hubei Gemvon Chemicals Co., Ltd [ China ] |
| Contact: | Hope Deng |
| Tel: | +86-27-84295986 |
| Fax: | +86-027-84295986 |
| Email: | zzfxcl@gmail.com |
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